| Place of Origin |
Guangdong, China (Mainland) |
| Brand Name |
XingDa |
| Model Number |
high TG pcb for mobile phone/ cellphone |
| Base Material |
FR-4,FR2.Taconic,Rogers, CEM-1,CEM-3, crockery, ceramic, aluminu etc. |
| Copper Thickness |
1/2 oz min;12 oz max |
| Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
| Min. Hole Size |
0.1mm(4mil) |
| Min. Line Width |
0.075mm(3mil) |
| Min. Line Spacing |
0.1mm(4mil) |
| Surface Finishing |
OSP, HASL, ENIG, ENEPIC, Immersion silver / tin / gold etc |
| solder mask: |
blue |
| Finish Board Thickness: |
0.2mm-6.00 mm(8mil-126mil) |
| Copper Thickness: |
1/2 oz min;12 oz max |
| Min.Trace Width & Line Spacing: |
0.075mm/0.1mm(3mil/4mil) |
| Min.Hole Diameter for CNC Driling: |
0.1mm(4mil) |
| Biggest panel size: |
610mm*508mm |
| Warp & Twist: |
0.5% |
| Impedance Control: |
+/-10% |
| PCB/ PCBA type: |
high TG pcb for mobile cellphone |
Payment & Shipping Terms:
| FOB Price: |
US $ 1.98-3.6/ Piece
Get Latest Price |
| Minimum Order Quantity: |
1 Piece/Pieces |
| Port: |
shenzhen |
| Packaging Details: |
1.at buyer's request; 2. inner, vaccum package; 3. outer, standard export carton for high TG pcb for mobile cellphone |
| Delivery Time: |
PCB: 8-10 days; PCBA: 20-25 days |
| Payment Terms: |
L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Supply Ability: |
50,000 Square Meter/Square Meters per Month |
Detailed Product Description
high TG pcb for mobile cellphone
1.ISO14001:2004& ISO9001:2000
2.UL,ROHS,T/S16949
3. high quality& best service
4. adop OEM
Welcome to XinDaxing Electric Technology Co., Ltd
high TG pcb (printed circuit board) for mobile phone / cellphone
We can prvide a package of service:
- 1. PCB layout, PCB design;
- 2: Make high difficulty PCB(1 to 38 layers)
- 3: Provide all Electronic components;
- 4: PCB assembly;
- 5: Write programs for clients;
- 6: PCBA/finished product Test.
- etc…
1.Specification for PCB Manufacture:
|
Item
|
Specification
|
|
Numbr of Layer
|
1-38Layers
|
|
Material
|
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery
|
|
Metal-backed Laminate
|
|
Remarks
|
High Tg CCL Is Availabe(Tg>=170ºC)
|
|
Finish Board Thickness
|
0.2mm-6.00 mm(8mil-126mil)
|
|
Minimun Core Thickness
|
0.075mm(3mil)
|
|
Copper Thickness
|
1/2 oz min;12 oz max
|
|
Min.Trace Width & Line Spacing
|
0.075mm/0.1mm(3mil/4mil)
|
|
Min.Hole Diameter for CNC Driling
|
0.1mm(4mil)
|
|
Min.Hole Diameter for punching
|
0.9mm(35mil)
|
|
Biggest panel size
|
610mm*508mm
|
|
Hole Positon
|
+/-0.075mm(3mil) CNC Driling
|
|
Conductor Width(W)
|
+/-0.05mm(2mil)or
|
|
+/-20% of original artwork
|
|
Hole Diameter(H)
|
PTH L:+/-0.075mm(3mil)
|
|
Non-PTH L:+/-0.05mm(2mil)
|
|
Outline Tolerance
|
+/-0.125mm(5mil) CNC Routing
|
|
+/-0.15mm(6mil) by Punching
|
|
Warp & Twist
|
0.70%
|
|
Insulation Resistance
|
10Kohm-20Mohm
|
|
Conductivity
|
<50ohm
|
|
Test Voltage
|
10-300V
|
|
Panel Size
|
110×100mm(min)
|
|
660×600mm(max)
|
|
Layer-layer misregistration
|
4 layers:0.15mm(6mil)max
|
|
6 layers:0.25mm(10mil)max
|
|
Min.spacing between hole edge to circuity pqttern of an inner layer
|
0.25mm(10mil)
|
|
Min.spacing between board oulineto circuitry pattern of an inner layer
|
0.25mm(10mil)
|
|
Board thickness tolerance
|
4 layers:+/-0.13mm(5mil)
|
|
6 layers:+/-0.15mm(6mil)
|
|
Impedance Control
|
+/-10%
|
|
Different Impendance
|
+-/10%
|
2. Details of tech:
PCB/ PCBA Technic
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
PCB/ PCBA Quote requirement
1).The detailed files(Gerber file/ PADS/ AutoCAD/ Protell/ Power PCB/ DWG/ schematic etc and BOM);
2).Clear pictures of PCBA or samples for us;
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