| Place of Origin |
Christmas Island |
| Brand Name |
Xing Da |
| Base Material |
FR4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed La |
| Copper Thickness |
1/2 oz min;12 oz max |
| Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
| Min. Hole Size |
0.25mm |
| Min. Line Width |
0.075mm(3mil) |
| Min. Line Spacing |
0.1mm |
| Surface Finishing |
HASL / HASL lead free, Chemical tin, Chemical Gold,OSP |
| Warp & Twist |
0.7% |
| Hole Positon |
+/-0.075mm(3mil) CNC Driling |
| Insulation Resistance |
10Kohm-20Mohm |
| Conductivity |
<50ohm |
| Test Voltage |
10-300V |
| ance Control |
+/-10% |
| Different Impendance |
+-/10% |
Payment & Shipping Terms:
| FOB Price: |
US $ 0.1-10/ Piece
Get Latest Price |
| Minimum Order Quantity: |
1 Piece/Pieces |
| Port: |
Shenhen/HK |
| Packaging Details: |
At buyer's request |
| Delivery Time: |
3-5 workdays |
| Payment Terms: |
T/T,Western Union |
| Supply Ability: |
50,000 Square Meter/Square Meters per Month |
Detailed Product Description
produce fr4 pcb double-sided pcb
1. PCB Layout,PCB design
2.1-38 layers boards
3.ISO9001/TS16949/IPC/ROHS/UL
Welcome to XingDa Electric Technology Co., Ltd
Xindaxing Electric Technology Co., Ltd
We are professional manufacturer in various PCB and PCBA for many years .We can provide a reasonable price with high quality products.
XingDa who can provide a full set of service.such as below:
* 1. PCB layout, PCB design
* 2: Make high difficulty PCB (1 to 38 layers)
* 3: Provide all Electronic component
* 4: PCB assembly
* 5: Write programs for clients
* 6: PCBA/finished product Test. etc.
1. PCB Specification detail.
|
|
Item
|
Specification
|
|
|
1
|
Number of Layer
|
1-38Layers
|
|
|
2
|
Material
|
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery Metal-backed Laminate
|
|
| |
|
3
|
Finish Board Thickness
|
0.2mm-6.00 mm(8mil-126mil)
|
|
|
4
|
Minimum Core Thickness
|
0.075mm(3mil)
|
|
|
5
|
Copper Thickness
|
1/2 oz min;12 oz max
|
|
|
6
|
Min. Trace Width & Line Spacing
|
0.075mm/0.1mm(3mil/4mil)
|
|
|
7
|
Min. Hole Diameter for CNC Drilling
|
0.1mm(4mil)
|
|
|
8
|
Min. Hole Diameter for punching
|
0.9mm(35mil)
|
|
|
9
|
Biggest panel size
|
610mm*508mm
|
|
|
10
|
Hole Position
|
+/-0.075mm(3mil) CNC Drilling
|
|
|
11
|
Conductor Width(W)
|
0.05mm(2mil)or;+/-20% of original artwork
|
|
|
12
|
Hole Diameter(H)
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PTH L:+/-0.075mm(3mil);Non-PTH L:+/-0.05mm(2mil)
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|
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13
|
Outline Tolerance
|
0.125mm(5mil) CNC Routing;+/-0.15mm(6mil) by Punching
|
|
|
14
|
Warp & Twist
|
0.70%
|
|
|
15
|
Insulation Resistance
|
10Kohm-20Mohm
|
|
|
16
|
Conductivity
|
<50ohm
|
|
|
17
|
Test Voltage
|
10-300V
|
|
|
18
|
Panel Size
|
110×100mm(min);660×600mm(max)
|
|
|
19
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Layer-layer misregistration
|
4 layers:0.15mm(6mil)max;6 layers:0.25mm(10mil)max
|
|
|
20
|
Min. spacing between hole edge to circuity pattern of an inner layer
|
0.25mm(10mil)
|
|
|
21
|
Min. spacing between board outline to circuitry pattern of an inner layer
|
0.25mm(10mil)
|
|
|
22
|
Board thickness tolerance
|
4 layers:+/-0.13mm(5mil);6 layers:+/-0.15mm(6mil)
|
|
|
23
|
Impedance Control
|
+/-10%
|
|
|
24
|
Different Impedance
|
+-/10%
|
|
2.Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes ,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT& Solder Assembly line;
6).High density interconnected board placement technology capacity.
Quote requirement
1).The detailed files(Gerber files ,specification and BOM);
2).Clear pictures of PCBA or samples for us;
3).PCBA Test method.
Click image to view original image
