| Place of Origin |
Guangdong, China (Mainland) |
| Brand Name |
Xingda |
| Base Material |
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic,crockery,Metal,Carbon |
| Copper Thickness |
1/2 oz min;12 oz max |
| Board Thickness |
0.2mm-6.00 mm(8mil-126mil) |
| Min. Hole Size |
0.1mm(4mil) |
| Min. Line Width |
0.075mm(3mil) |
| Min. Line Spacing |
0.1mm4mil) |
| Surface Finishing |
Immersion Gold/Au,HASL,OSP,etc. |
| PCB Assembly service |
SMT PCBA |
| pcb design services |
pcba pcb assembly ts16949 |
Payment & Shipping Terms:
| FOB Price: |
Get Latest Price |
| Minimum Order Quantity: |
1 Perch/Perches |
| Port: |
Shenzhen |
| Packaging Details: |
Vacuum Packing |
| Delivery Time: |
3-5 workdays |
| Payment Terms: |
T/T,Western Union |
| Supply Ability: |
50000 Square Meter/Square Meters per Week |
Detailed Product Description
PCB Assembly
1.PCB&PCBA
2.ISO9001/TS16949/ROHS/UL
3.OEM PCB Assembly is welcome
4.High Quality,Reasonable Price&Best Service
Welcome to XinDaxing PCB&PCBA SMT&SMD processing service
Shenzhen Xindaxing Electric Technology Co., Ltd.
(Xing Da Electric Technology Co.,Ltd),which has been specializing in PCB/PCBA and Electronic components for many years.
We can prvide a package of service:
pcba pcb assembly ts16949,PCB Assembly service,SMT PCBA,pcba pcb assembly ts16949,PCB Assembly SMT&SMD Processing service,China PCBA EMS Manufacturer,PCB Assembly DIP service,UPS PCB Assembly,pcb assembly for li ion battery charger,Telecommunication PCBA motherboard,China PCB Assembly soldering supplier/manufacturer
- 1. PCB layout, PCB design;
- 2: Make high difficulty PCB(1 to 38 layers)
- 3: Provide all Electronic components;
- 4: PCB assembly;
- 5: Write programs for clients;
- 6: PCBA/finished product Test.
- etc…
1.Specification for PCB Manufacture:
|
Item
|
Specification
|
|
Numbr of Layer
|
1-38Layers
|
|
Material
|
FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery
|
|
Metal-backed Laminate
|
|
Remarks
|
High Tg CCL Is Availabe(Tg>=170ºC)
|
|
Finish Board Thickness
|
0.2mm-6.00 mm(8mil-126mil)
|
|
Minimun Core Thickness
|
0.075mm(3mil)
|
|
Copper Thickness
|
1/2 oz min;12 oz max
|
|
Min.Trace Width & Line Spacing
|
0.075mm/0.1mm(3mil/4mil)
|
|
Min.Hole Diameter for CNC Driling
|
0.1mm(4mil)
|
|
Min.Hole Diameter for punching
|
0.9mm(35mil)
|
|
Biggest panel size
|
610mm*508mm
|
|
Hole Positon
|
+/-0.075mm(3mil) CNC Driling
|
|
Conductor Width(W)
|
+/-0.05mm(2mil)or
|
|
+/-20% of original artwork
|
|
Hole Diameter(H)
|
PTH L:+/-0.075mm(3mil)
|
|
Non-PTH L:+/-0.05mm(2mil)
|
|
Outline Tolerance
|
+/-0.125mm(5mil) CNC Routing
|
|
+/-0.15mm(6mil) by Punching
|
|
Warp & Twist
|
0.70%
|
|
Insulation Resistance
|
10Kohm-20Mohm
|
|
Conductivity
|
<50ohm
|
|
Test Voltage
|
10-300V
|
|
Panel Size
|
110×100mm(min)
|
|
660×600mm(max)
|
|
Layer-layer misregistration
|
4 layers:0.15mm(6mil)max
|
|
6 layers:0.25mm(10mil)max
|
|
Min.spacing between hole edge to circuity pqttern of an inner layer
|
0.25mm(10mil)
|
|
Min.spacing between board oulineto circuitry pattern of an inner layer
|
0.25mm(10mil)
|
|
Board thickness tolerance
|
4 layers:+/-0.13mm(5mil)
|
|
6 layers:+/-0.15mm(6mil)
|
|
Impedance Control
|
+/-10%
|
|
Different Impendance
|
+-/10%
|
2.Details for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
Quote requirement
1).Many agile forms of cooperation(OEM ,ODM) are welcome!
2).The detailed files(Gerber files,specification and BOM);
3).Clear pictures of PCBA or samples for us;
4).PCBA Test method.