1. Layer count: 6 layers
2. Board thickness: 1.60mm
3. Material type: FR-4 94V0 Tg>=135°
4. Outer/Inner copper thick: 1oz/1oz
5. Min. line width/space: 4mil/5mil
5. Min. line width/space: 4mil/5mil
6. Min. hole diameter: 12mil
7. Solder resist:LPI Dark blue
8. Silkscreen color:None
9. Surface treatment: ENIG
10.Application scope: Used in Cameras
11.Special note: 1.RoHS conformed
2.vias plugged with soldermask
3.control impedance demand
12. Figuration: Routing